Session 6B-4
Nonvolatile solid-electrolyte switch embedded
into Cu interconnect
| A solid-electrolyte switch (NanoBridge) has been successfully embedded into a 0.13-um-node dual-damascene Cu interconnect using a highly reliable bilayer solid-electrolyte (TaSiO/Ta2O5) and a thin-oxidation barrier, resulting in an excellent ON/OFF ratio (> 109) at a low ON resistance of 50Ohm. The newly developed bilayer solid-electrolyte has improved the thermal stability during the BEOL process as well as improved electrical breakdown. The CMOS compatible, NanoBridge a promising switch to achieve high-performance and low-cost FPGAs. |