Session 5-1

Measurement, Analysis and Improvement
of Supply Noise in 3D ICs

 

Abstract

Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.