Session 10A-2

From 3D-SOC to 3D Heterogeneous Systems:
Technology and Applications

 

Abstract

A wide range of requests coming from customer appears to demonstrate the feasibility of 3D Integration (3DI). The first industrial application is the CMOS Image Sensor. Medium to high density applications are related to consumer & wireless markets were 3DI overcomes limitations of SOC in term of performances, cost and time to market. For More than Moore applications, 3DI brings real heterogeneous integration with multi-physics systems such as complex camera module, wireless links and sensors.