Session 5B-3

A Method to Maintain Phase-Change Memory Pre-coding Data Retention
after High Temperature Solder Bonding Process in Embedded Systems

 

Abstract

For the first time we demonstrate that a Phase Change Memory (PCM) packaged chip can hold pre-coded data after an industrial standard lead free solder bonding reflow process. Good "0" and "1" state distributions are retained in a 90nm 128Mb PCM chip after the soldering process. Furthermore, the tested chip endures more than 10 million write cycles after the pre-coding and high temperature process.