Session 15 – Honolulu Suite

Analog Sensor Interfaces

Thursday, June 14, 3:25p.m.

Chairpersons: J. Lloyd, Analog Devices

J. Lee, National Taiwan University

15.1 - 3:25 p.m.

High-resolution Sensing Sheet for Structural-health Monitoring via Scalable Interfacing of Flexible Electronics with High-performance ICs, Y. Hu, W. Rieutort-Louis, J. Sanz-Robinson, K. Song, J.C. Sturm, S. Wagner, N. Verma, Princeton University

Early-stage damage detection for buildings and bridges requires continuously sensing and assessing strain over large surfaces, yet with centimeter-scale resolution. To achieve this, we present a sensing sheet that combines high-performance ICs with flexible electronics, allowing bonding to such surfaces. The flexible electronics integrates thin-film strain gauges and amorphous-silicon control circuits, patterned on a polyimide sheet that can potentially span large areas. Non-contact links couple digital and analog signals to the ICs, allowing many ICs to be introduced via low-cost sheet lamination for energy-efficient readout and computation over a large number of sensors. Communication between distributed ICs is achieved by transceivers that exploit low-loss interconnects patterned on the polyimide sheet; the transceivers self-calibrate to the interconnect impedance to maximize transmit SNR. The system achieves multi-channel strain readout with sensitivity of 18 uStrainRMS at an energy per measurement of 270nJ, while the communication energy is 12.8pJ/3.3pJ per bit (Tx/Rx) over 7.5m.

15.2 - 3:50 p.m.

Nanostructured CMOS Wireless Ultra-Wideband Label-free DNA Analysis SoC, H.M. Jafari, L. Soleymani*, K. Abdelhalim, E. Sargent, S. Kelley, Roman Genov, University of Toronto, *McMaster University

A 0.13-micron CMOS fully integrated 48-channel UWB label-free DNA analysis SoC is demonstrated in prostate can- cer screening. The 3mm*3mm die includes 578 nanostructured DNA sensors, 48 pH sensors, and 48 temperature sensors and reuses key circuits for cyclic voltammetry, amperometry and temperature regulation.

15.3 - 4:15 p.m.

A Fully Integrated Hepatitis B Virus (HBV) DNA Detection SoC based on Monolithic Polysilicon Nanowire CMOS Process, C.-W. Huang, Y.-J. Huang, P.-W. Yen, H.-T. Hsueh, C.-Y. Lin*, M.-C. Chen*, C.-H. Ho*, F.-L. Yang*, H.-H. Tsai**, H.-H. Liao**, Y.-Z. Juang**, C.-K. Wang, C.-T. Lin, S.-S. Lu, National Taiwan University, *National Nano Device Laboratories, **National Applied Research Laboratories

Polysilicon nanowire (poly-Si NW) based biosensor is integrated with the wireless acquisition circuits in a standard CMOS SoC for the first time. To improve detection quality, a chopper DDA-based analog front-end with features of low noise, high CMRR, and rail-to-rail input range is implemented. Additional temperature sensor is also included to compensate temperature drift of the biosensor. The results indicate that the detection limit is as low as 10fM. The capability to distinguish one base-pair mismatched DNAs is also demonstrated.

15.4 - 4:40 p.m.

A Fully-Electronic Charge-Based DNA Sequencing CMOS Biochip, A. Manickam, R. Singh, N. Wood, B. Li, A. Ellington, A. Hassibi, University of Texas at Austin

A 90x90 fully-electronic biosensor array for charge-based DNA sequence-by-synthesis is implemented in a 0.18µm standard CMOS process. Each 16um x 16um pixel consists of an integrated charge-sensing electrode connected to an embedded circuitry capable of detecting DNA polymerization and simultaneously measuring the electrode-electrolyte interface capacitance. The detection dynamic range of this sensor is +90dB while consuming 4 mW from a 3.3V supply when operating at 8.1s/frame.

15.5 - 5:05 p.m.

An 88dB SNR, 30µm Pixel Pitch Infra-Red Image Sensor with a 2-Step 16 bit A/D Conversion, A. Peizerat, J.-P. Rostaing, N. Zitouni, N. Baier, F. Guellec, R. Jalby, M. Tchagaspanian, CEA-LETI, Minatec

A new readout IC (ROIC) with a 2 step A/D conversion for cooled infrared image sensors is presented in this paper. The sensor operates at a 50Hz frame rate in an Integrate-While-Read snapshot mode. The 16 bit ADC resolution preserves the excellent detector SNR at full well (~3Ge-). The ROIC, featuring a 320x256 array with 30µm pixel pitch, has been designed in a standard 0.18µm CMOS technology. The IC has been hybridized (indium bump bonding) to a LWIR (Long Wave Infra Red) detector fabricated using our in-house HgCdTe process. The first measurement results of the detector assembly validate both the 2-step ADC concept and its circuit implementation. This work sets a new state-of-the-art SNR of 88dB.