Session 8 – TAPA 1
RRAM I
Wednesday, June 13, 8:05 a.m.
Chairs: J. Zahurak, Micron Technology,
Inc.
N. Kasai, Tohoku
Univ.
8.1 - 8:05 a.m.
A
Novel Cross Point One-Resistor (0T1R) Conductive Bridge Random Access Memory (CBRAM)
with Ultra Low Set/Reset Operation Current, F.M.
Lee, Y.Y. Lin, M.H. Lee, W.C. Chien, H.L. Lung, K.Y. Hsieh, C.Y. Lu, Macronix
International Co., Ltd.
Using the dual Vth characteristics of a multi-layer
HfO2/SiO2/Cu-GST conducting bridge (CB) structure we can construct a
one-resistor cell without an access device (0T1R). Like 1T Flash memory the Vth
is used to store the logic state thus leaving all devices always at high
resistance state and a separate isolation device is not needed. The Vth of the
cell is determined by the presence of CB in the HfO2 layer only. The CB in the
SiO2 is present only temporarily during reading, and is spontaneously dissolved
afterward. This spontaneous rupture of the filament in the SiO2 layer greatly
reduces the switching current as well as reducing the read disturb. The
mechanism for the spontaneous rupture phenomenon is investigated.
8.2 - 8:30 a.m.
Field-Driven
Ultrafast sub-ns Programming in W\Al2O3\Ti\CuTe-Based
1T1R CBRAM System, L.
Goux, K. Sankaran, G. Kar, N. Jossart, K. Opsomer, R. Degraeve, G. Pourtois, G.-M.
Rignanese*, C. Detavernier**, S. Clima, Y.-Y. Chen, A. Fantini, B. Govoreanu,
D.J. Wouters, M. Jurczak, L. Altimime, J. Kittl, imec, *UCL and ETSF,
**University of Gent
We optimize a 90nm-wide CuTe-based 1T1R CBRAM cell for highly
controlled and ultrafast programming by engineering Al2O3 electrolyte and Ti
buffer layers of appropriate density and thickness resp. By means of electrical
and ab initio modeling, we demonstrate that switching is mainly controlled by
field-driven motion of Cu+ species. Sub-ns programming is allowed by strong
ionic-hopping barrier reduction over short insulating gap. Complete picture of
conductance and switching phenomenology is shown in the entire operation range.
8.3 - 8:55 a.m.
Multi-level
Switching of Triple-layered TaOx RRAM with Excellent Reliability for Storage
Class Memory, S.R.
Lee, Y.-B. Kim, M. Chang, K.M. Kim, C.B. Lee, J.H. Hur, G.-S. Park, D.
Lee, M.-J. Lee, C.J. Kim, U.-I. Chung, I.-K. Yoo, K. Kim, Samsung Advanced
Institute of Technology
A highly reliable RRAM with multi-level cell (MLC)
characteristics were fabricated using a triple-layer structure (base
layer/oxygen exchange layer/barrier layer) for the storage class memory
applications. A reproducible multi-level switching behaviour was successfully
observed, and simulated by the modulated Schottky barrier model. Morevoer, a
new programming algorithm was developed for more reliable and uniform MLC
operation. As a result, more than 10^7 cycles of switching endurance and 10
years of data retention at 85C for all the 2 bit/cell operation were archieved.
8.4 - 9:20 a.m.
Conductive
Filament Scaling of TaOx Bipolar ReRAM for Long Retention with Low Current
Operation, T.
Ninomiya, T. Takagi, Z. Wei, S. Muraoka, R. Yasuhara, K. Katayama, Y. Ikeda, K.
Kawai, Y. Kato, Y. Kawashima, S. Ito, T. Mikawa, K. Shimakawa, K.Aono,
Panasonic Corporation
We demonstrate for the first time that the density of oxygen
vacancy in a conductive filament plays a key role in ensuring data retention.
We achieve very good retention results up to 100 hours at 150˚C even under
the low current operation due to the scaling of conductive filament size while retaining
sufficiently high density of oxygen vacancy.
8.5 - 9:45 a.m.
Dynamic
‘Hour Glass’ Model for SET and RESET in HfO2 RRAM, R. Degraeve, A. Fantini, S. Clima, B.
Govoreanu, L. Goux, Y.Y. Chen, D. Wouters, P. Roussel, G.S. Kar, G. Pourtois, S.
Cosemans, J. Kittle, G. Groeseneken, M. Jurczak, L. Altimime, IMEC
The set and reset process in HfO2 RRAM filament is modeled as
a dynamic flow between two oxygen vacancy reservoirs connected by a narrow
filament. The current is controlled by
the width of the filament, that determines the electron transmission. The
diffusion of oxygen vacancies is controlled by the local power in the
filament. As a result, RESET is modeled
as a dynamic balance between an upward and downward vacancy flow, while SET is
modeled as an unbalanced filament growth bounded by the external compliance.