SC1: Circuits Short Course | Circuits and Systems for Heterogeneous Integration
Organizers: C. Tokunaga, Intel, T. Nezuka, MIRISE Technologies, N. Kocaman, Broadcom, K. Nii, TSMC
Lunch is included with in-person short course registration.
Includes the following presentations:
- Introduction, Liwei Wang, AMD
- I/O design considerations for die-to-die interface, Yoshinori Nishi, NVIDIA
- Directions, Challenges and Opportunities in Heterogeneous Integration and Packaging, Chris Pelto, Intel
- Heterogenous integration for automotive ICs, Hubert Bode, NXP
- Wafer Scale System Integration Technology, Kuo-Chung Yee, TSMC
- Memory Co-Integration, Kyungryun Kim and Wonkyoung Choi, Samsung
- Evolution and Future of Heterogenous 3D Integrated Circuits and their Design using EDA Tools, David Stratman
- Integrated Power Delivery and Management Technologies for Heterogenous Integrated Systems, Hanh-Phuc Le, University of California, San Diego
SC2: Technology Short Course | Advanced VLSI Technologies for Next Generation Computing
Organizers: Yue Liang, Nvidia; Shosuke Fujii, Kioxia
Lunch is included with in-person short course registration.
Includes the following presentations:
- CMOS Device Scaling for Power-Performance-Key Physics and Challenges, Jeff Wu, TSMC
- Innovations of Material and Process Engineering in the Angstrom Era for Advanced CMOS Logic Technology, Veeraraghavan Basker, Applied Materials
- Integration Challenges for Pitch Scaling in Advanced BEOL Interconnects, Hirokazu Aizawa, TEL
- Functional Backside: past, present, and STCO future, James Myers, IMEC
- In-memory-computing with emerging memories, J. Joshua Yang, University of Southern California
- Opportunities to break through limit and to enable prolongation of DRAM, Hui-Jung Kim, Samsung Electronics
- Metrology & Inspection: Past, Present, and Future, Byoungho Lee, Hitachi High-Tech
- Silicon photonics for high bandwidth optical I/O, Haisheng Rong, Intel Labs
