Embedded Memory Design Short Course
Tuesday, June 17, Honolulu I
Organizers/Chairs: |
John Barth, IBM
Masao Ito, Renesas Technology Corporation |
8:10 a.m. |
Introduction |
8:15 a.m. |
Embedded Memory Overview (and DRAM)
S. Natarajan, TSMC Design Technology Canada |
9:25 a.m. |
Static RAM
M. Yamaoka, Hitachi, Ltd. |
10:35 a.m. |
Break |
10:50 a.m. |
Floating Body RAM
T. Ohsawa, Toshiba Corp. |
12:00 p.m. |
Lunch |
1:30 p.m. |
Phase Change RAM
C. Lam, IBM |
2:40 p.m. |
Break |
2:55 p.m. |
Flash
R. Kakoschke, Infineon |
4:05 p.m. |
Built in Self Test
D. Weiss, AMD |
5:15 p.m. |
Conclusion
M. Ito, Renesas Technology Corp. |
Embedded Power Management Circuits and Systems Short Course
Tuesday, June 17, Honolulu II
Organizers/Chairs: |
Tom Kwan, Broadcom Corp.
Koichi Nose, NEC Corp. |
8:10 a.m. |
Introduction
T. Kwan, Broadcom Corp. |
8:15 a.m. |
Overview of Embedded Power Management Circuits and Systems in SoC's
D. Anderson, National Semiconductor Corp. |
9:25 a.m. |
Integrated Power Management for Mobile SoC's
D. Ho, Broadcom Corp. |
10:35 a.m. |
Break |
10:50 a.m. |
Circuit Design for Power Management Building Blocks
W.-H. Ki, Hong Kong University of Science and Technology |
12:00 p.m. |
Lunch |
1:30 p.m. |
Thermal Management of High-Performance Processors
E. Miranda, Analog Devices Corp. |
2:40 p.m. |
Break |
2:55 p.m. |
Power Management at the System/Architecture/Circuit Level
M. Nomura, NEC |
4:05 p.m. |
Dynamic Power/Thermal Management in High Performance Processors; Examples and Opportunities
S. Nafziger, AMD |
5:15 p.m. |
Speaker Interview Session |
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