Sunday Workshop 3

Workshop on Low Thermal Budget Dopant Activation for Sequential-3D Integration

Organizer:
Rino Choi (Inha Univ., Korea),
Jia-Min Shieh (TSRI-Narlabs, Taiwan),
Perrine Batude (CEA-Leti, France)

Abstract / objectives:
The workshop is aiming at sharing and gaining expertise on junction design considering the thermal constraints associated to sequential 3D integration. It will gather researchers from various fields including process, integration, simulation and theory. The WS will review all the strategies used or potentially useful for low T junction design: laser and microwave annealing, solid phase epitaxy regrowth, in situ doped epitaxy. We are aiming at creating momentum around low T junctions which could also be fed back to mainstream technologies when it comes to abruptness management.