VLSI Joint Short Course

Heterogeneous Integration-To Boldly Go Where No Moore Has Gone Before
Organizers: Alvin Loke (TSMC), Kazuhiko Endo (AIST), Makoto Nagata (Kobe University), Vijay Narayanan (IBM)

1. Chiplet Meets the Real World: Benefits and Limits of Chiplet Designs –  Sam Naffziger (AMD)
2. Heterogeneous System Partitioning and the 3D Interconnect technology Landscape –  Eric Beyne (IMEC)
3. Back-End Based Chiplet Integration Solutions & Roadmap –  C. Key Chung (SPIL/ASE)
4. Heterogeneous Integration for AI Architectures –  Arvind Kumar & Mukta Farooq (IBM)
5. Heterogeneous Integration of Chiplets for Sensors –  Marco Del Sarto (ST)
6. Chiplet-to-Chiplet Communication Circuits for 2.5D/3D Integration Technologies –  Kenny Hsieh (TSMC)
7. Performance-Driven Design Methodology and Tools for 2.5D/3D Multi-Die Integration –  Rajesh Gupta (Synopsys)
8. Generic design strategies & considerations for 2.5D and 3D stacked IC designs –  Kichul Chun (Samsung)

Details Soon!