Moore
NanoSheet Transistor as a Replacement of FinFET for Future nodes : Device Advantages & Specific Process Elements
Nicolas Loubet (IBM)
On-die Interconnect challenges and opportunities for future technology nodes
Mauro Kobrinsky (INTEL)
Challenges and prospects of memory scaling
Gwan-Hyeob Koh (Samsung)
Ferroelectric Hafnium Oxide: From Memory to Emerging Applications’
Uwe Schroeder (Namlab)
EUV lithography and its application to logic and memory devices
Tony Yen (ASML)
More Than Moore
Emerging technologies for low cost TSV-free monolithic 3DIC
Dr. Chang-Hong Shen- Research Fellow , Taiwan Semiconductor Research Institute (TSRI)
Insitu BEOL transistors and oxide electronics
Suman Datta
Layer transfer technology for heterogeneous material integration
Dr. Tatsuro Maeda, AIST