PLENARY & PANELS | Symposia on VLSI Technology and Circuits

3D/Heterogeneous integration: Are we running towards a Thermal Crisis?

Moderator:

Takayuki Ohba, Tokyo Institute of Technology: About Takayuki Ohba

Prof. Takayuki Ohba received his Ph.D. degree from Tohoku University (Electrical Communication) in 1995. Dr. Ohba entered Fujitsu Limited in 1984 after joining Non-aqueous Solution Chemical Laboratories at Tohoku University. At Fujitsu Ltd. in Process Development Department, W and TiN CVD are distinguish achievements being widely used in the semiconductor manufacturing. He developed total integration processes of the 90-nm high performance logic devices. He was appointed to The University of Tokyo in 2004 and moved to Tokyo Institute of Technology in 2013. Prof. Ohba is conducting global alliance so-called WOW Alliance and three-dimensional integration (3DI) for the post-scaling since 2007. The bump-free (bumpless) interconnects and ultra-thinning of wafer >5 micrometer technologies for the application of memory-memory and memory-logic 3D stack are developed. His basic interest is production-worthy processes and co-integration to achieve ultra-small Tera-scale devices without sacrificing power efficiency and cost. Prof. Ohba has contributed more than 100 papers through these studies. He is visiting Professor of National Chiao Tung University at Taiwan and a member of the JAP, IEICE, IEEE, EDS, MRS, MAM, IMAPS, and ADMETA, respectively.

Although 3DI including 2.5D system has many benefits in terms of performance and size reduction, it is unavoidable to provide thermal management without sacrifying reliability. Thermal management has been conducted many decades, since semiconductors started. Now the industry is facing serious limitations due to increasing density of 3DI in the computer system.
• Thermal management trends toward high density 3DI
• How to cool high power 2.5D and 3D systems?
• How to optimize performance and size vs cooling in the mobile phone?
• Future trends on Hot Supercomputer
• What leads to Thermal Crisis?
• Limitation of Air cooling and Liquid cooling

Live Session: June 17, 8:00AM-9:00AM (JST)

Panelists:

Ravi Mahajan, Intel Fellow: About Ravi Mahajan

Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning his Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel’s EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE.

Victor Adrian Chiriac, GCTG LLC (Former Qualcomm): About Victor Adrian Chiriac

A Fellow of the American Society of Mechanical Engineers (ASME) since 2014, Dr. Victor Adrian Chiriac has made outstanding industry wide contributions to the art and science of thermal management and cooling of electronic packages and portable consumer electronic devices with focus on wireless technologies in the smart phones, tablets, laptops, IoT, AR/VR devices, automotive, data centers and beyond.
Since 2019, Dr. Victor Adrian Chiriac is a co-founder and a managing partner with the Global Cooling Technology Group in Phoenix, Arizona, USA. He previously held technology/engineering leadership roles with Motorola (1999-2010), Qualcomm (2010 - 2018) and Huawei R&D USA (2018 - 2019). In his previous leadership technology role for Qualcomm Technologies Inc in San Diego California, Victor defined the company overall thermal technology roadmap for developing state of the art cooling solutions at the chip, electronic package and system level product implementation, between 2010-2018. During his Qualcomm tenure, Victor drove the novel/breakthrough thermal technology development from design phase through prototype manufacturing and testing. He collaborated across global business lines, senior management, and external customers in resolving major thermal issues and delivering multiple thermal technology projects on time, on budget, and to specification.
Dr. Chiriac was elected Chair of the ASME K-16 Electronics Cooling Committee and was elected IMAPS Chapter President for Arizona and New Mexico. He is a leading member of the organizing committees of ASME/InterPack, ASME/ IMECE and IEEE/CPMT ITherm Conferences. He holds19 U.S. issued patents, 4 Patents in review, 2 trade secrets and one U.S. defensive publication, and has published over 107 papers in scientific journals. He earned his Ph. D. (1999) in Aerospace/Mechanical Engineering, from the University of Arizona, Tucson, USA.

Hiroyuki Ryoson, Dexerials: About Hiroyuki Ryoson

Hiroyuki Ryoson finished the master’s degree in mechanical engineering at Kyoto University in 1990, and he joined Sony Corporation in 1990 and researched mainly in mechanical field. He is now an executive chief engineer in Dexerials Corporation (former Sony Chemical), and managing every theme in technology side in this company.

Kuo-Chung Yee, TSMC: About Kuo-Chung Yee

Dr. KC Yee is currently a R&D Director of TSMC with main work function on Pathfinding for System Integration. He received his Ph.D. degree from the Department of Mechanical Engineering at the University of Texas at Austin. Dr. Yee has 20+ years of semiconductor experiences in advanced packaging including optical MEMS, optoelectronics, advanced flip chip, wireless connectivity module, 2.5D, wafer level fan-out and 3D IC system integration. He is currently active members of SEMI Taiwan Packaging & Testing Committee, ECTC Packaging Technologies sub-committee, EPS Strategic Planning committee and Nano Technology and Micro System Association in Taiwan. Dr. Yee received China Society of Engineers Distinguished Engineer Award in 2007 and owned/ co-owned 60+ granted US patents.

Circuits Panel

New Generation Chip Makers vs. the Incumbents

Moderator:

Naveen Verma, Princeton University: About Naveen Verma

Naveen Verma received the B.A.Sc. degree in Electrical and Computer Engineering from UBC, Vancouver, Canada in 2003, and the M.S. and Ph.D.
degrees in Electrical Engineering from MIT in 2005 and 2009 respectively. Since 2009 he has been at Princeton University, where he is current Director of the Keller Center for Innovation in Engineering Education and Professor of Electrical and Computer Engineering. His research focuses on advanced sensing systems, exploring how systems for learning, inference, and action planning can be enhanced by algorithms that exploit new sensing and computing technologies. This includes research on large-area, flexible sensors, energy-efficient statistical-computing architectures and circuits, and machine-learning and statistical-signal-processing algorithms. Prof. Verma is the recipient of several research and teaching awards, including co-recipient of several best-paper awards with his students. He has served as a Distinguished Lecturer of the IEEE Solid-State Circuits Society and on the technical committees of various conferences and professional societies.

The world needs silicon more than ever! This is largely because the applications where sensing, computing, and communication chips are needed is broader than ever, encompassing healthcare, scientific discovery, automotive/transportation, industrial automation, and beyond. Silicon provides specific and critical enablement and differentiation in these applications, through the systems they are built on. This has already driven a change in the ecosystem, where system companies have embraced in-house silicon development. What does this trend mean for silicon innovation and impact, and where might this trend lead us? Is this a renaissance moment, or is it opening up dual/multiple tracks for silicon innovation? What are the differences in the innovation culture across these tracks? What types of innovators are needed to thrive in and maximize the impact of these tracks? How does all of this relate to constraints in the silicon supply chain? This panel brings together innovators across the emerging tracks to provide insights and counter viewpoints – some you would have expected and others you need the insider’s views to appreciate.

Live Session: June 17, 7:00AM-8:30AM (JST)

Panelists:

Joe Macri, AMD: About Joe Macri

Joe Macri is a 35 year veteran of the computer industry. He has worked extensively in the areas of CPU, graphic, memory and high performance dram design. He holds over 25 patents in these areas. He has worked at DEC, SGI, ArtX and now AMD in both technical and leadership positions. Lastly he sits on the JEDEC and GenZ boards of directors.

Jean-Francois Vidon, Qualcomm: About Jean-Francois Vidon

Jean-Francois Vidon is senior director of technology at Qualcomm, responsible for Arm CPU PPA (Performance, Power, Area) and front end implementation for mobile SoCs. Jean-Francois joined Qualcomm in 2012 and initially led the formation of the PPA Team working on process PPA tradeoff across various technology nodes. Jean-Francois led the challenge of implementing the new power-efficient Snapdragon CPU family based on Arm Core.
Prior to joining Qualcomm, he has been working at ST-Ericsson with significant expertise build in RTL Design, Design for Test, low power implementation across Modems and Multimedia Mobiles SoC’s. Jean-Francois holds a Master in Digital Electronics from Ecole National Supérieure d’Electronique et de Radioélectricité de Grenoble (INPG).

Ganesh Venkataramanan, Tesla: About Ganesh Venkataramanan

Ganesh Venkataramanan is Senior Director of Autopilot Hardware Design at Tesla and is responsible for Silicon and System designs. Ganesh is one of the founding members of Tesla’s silicon design team which delivered a revolutionary FSD computer that has set the industry bar for Machine learning inference solutions. He has built world class technologies and team of engineers who tackle and solve some of the toughest problems. Prior to Tesla, he worked at AMD as Senior Director leading CPU development teams and was instrumental in leading and overhauling AMD roadmaps to Zen/K12 cores. During his 15+ year tenure at AMD, he worked on many x86 cores including first Opteron-64 and the industry’s first dual core x86 processor. Ganesh holds Bachelors in Electronics from Bombay University and Master’s in Integrated Electronics and Circuits from IIT Delhi and has 20+ patents in the field of chip design. He serves as an advisory board member of Global Semiconductor Association.

Don Stark, Google: About Don Stark

Don Stark has been a Principal Engineer at Google since 2011, where he has worked on the designs of the Tensor Processing Units (TPU's) for ML, Video Coding Unit (VCU) for YouTube, The Pixel Visual and Pixel Neural Core for smartphones, and the Titan security chips. Prior to Google, he has worked on an eclectic set of technologies and products, including Ethernet, DSL, high speed SerDes, mobile television, microfluidics, and DRAM.
Don holds a BS from MIT and MS/ Ph.D. degrees from Stanford, all in Electrical Engineering.

Yusuke Doi, Preferred Networks: About Yusuke Doi

Yusuke Doi is Corporate Officer and VP of Computing Infrastructure, Preferred Networks, Inc. Joined Preferred Networks in 2016. He worked on the design, management, and operation of the computing infrastructure of Preferred Networks.

Joint Panel

The New Normal… How will it Change Work, Life and Education?

Moderator:

Kazuo Yano, Hitachi: About Kazuo Yano

Kazuo Yano is a Fellow, Hitachi Ltd, and CEO, Happiness Planet Ltd. He is known for the pioneering works in the world-first room-temperature single-electron memories. He has pioneered the measurement and analysis of social big data. He and coworkers have succeeded quantifying the happiness of people from unconscious physical motion and has founded "Happiness Planet, Ltd" in 2020 for enhancing happiness and psychological capital through technology. He has provided keynote speeches on data for happiness worldwide.
He has applied over 350 patents and his papers are cited by over 4500 papers. His book, "The Invisible Hand of Data," is cited as one of top-10 business books in Japan in 2014.
He received 2020 IEEE Frederik Phillips Award and many other international awards. He is a Fellow of the IEEE.

This pandemic changes our minds and behaviors, and changes our lives, work, and education. In this panel, a variety of leading experts from Zen Buddhism, wellbeing science, computer-human interfaces, to media art will join to deepen the meaning of this irreversible change and discuss the changing role of technology.

Live Session: June 18, 7:30AM-8:30AM (JST)

Panelists:

Joseph A. Paradiso, MIT Media Lab: About Joseph A. Paradiso

Joseph Paradiso is the Alexander W. Dreyfoos (1954) Professor in Media Arts and Sciences, where he serves as the Associate Academic Head and directs the Media Lab’s Responsive Environments group, which explores how sensor networks augment and mediate human experience, interaction, and perception. Paradiso worked as a Tufts undergrad (where he received his BS in electrical engineering and physics summa cum laude in 1977) on precision inertial guidance systems at Draper Lab, then completed his PhD in physics at MIT in 1981, while working with Prof. S.C.C. Ting’s group at CERN in Geneva as a K.T. Compton Fellow. After two years developing precision drift chambers at the Lab for High Energy Physics at ETH in Zurich, he joined the NASA-affiliated group at Draper Laboratory, where his research encompassed spacecraft control systems, image processing algorithms, underwater sonar, and precision alignment sensors for large high-energy physics detectors. He joined the Media Lab in 1994, where his current research interests include wireless sensing systems, wearable and body sensor networks, energy harvesting and power management for embedded sensors, ubiquitous/pervasive computing and the Internet of Things, human-computer interfaces, space-based systems, and interactive music/media. He has written over 350 publications and frequently lectures in these areas. In his spare time, he enjoys designing/building electronic music synthesizers, composing electronic soundscapes, and seeking out edgy and unusual music while traveling the world.

Takafumi Zenryu Kawakami, Shunkoin in Myoshinji Temple: About Takafumi Zenryu Kawakami

Zen priest and thinker. He is the deputy head priest of Shunkoin Temple in Kyoto and teach Zen Buddhist philosophy and meditation, other Eastern contemplative traditions, and the cultural and religious diversity in well-being in Japanese and English to visitors to the temple. The participants include various business school groups, including HBS, INSEAD, IESE, Sloan, etc. He co-organizes and co-hosts long-term study abroad programs in Kyoto with various universities from the U.S. He teaches Japanese hospitality classes to employees from the sales and marketing departments from Toyota’s global offices. His travels and talks have brought his to the likes of MIT, Brown University, Microsoft, TED x Kyoto, Mind & Life Institute’s ISCS & IRI, Eton College, etc. He is a member of the U.S.- Japan Leadership Program by the U.S. – Japan Foundation.

Junichi Rekimoto, The University of Tokyo / Sony Computer Science Laboratories, Inc.: About Junichi Rekimoto

Jun Rekimoto received his Ph.D. in Information Science from Tokyo Institute of Technology in 1996. Since 1994 he has worked for Sony Computer Science Laboratories (Sony CSL). In 1999 he formed and directed the Interaction Laboratory within Sony CSL. Since 2007 he has been a professor in the Interfaculty Initiative in Information Studies at The University of Tokyo. Since 2011 he also has been Fellow and Deputy Director of Sony CSL, and since 2020 he also has been a director of Sony CSL Kyoto. Rekimoto’s research interests include human-computer interaction, computer augmented environments, human augmentation, Internet of Abilities (IoA) and human-AI-integration. He invented various innovative technologies including NaviCam (the world's first hand-held AR system), CyberCode (the world’s first marker-based AR system), and SmartSkin (one of the earliest representations of multi-touch systems). He is a member of the ACM SIGCHI Academy and won numerous research and design awards for his research.

Alden Lai, New York University: About Alden Lai

Alden Lai, PhD, MPH, is Assistant Professor of Public Health Policy and Management at New York University. He studies how health care professionals and managers can achieve wellbeing at work, and consequently, improve the safety performance of health care organizations. Dr. Lai has consulted for federal and state governments, health systems, international and non-profit organizations, private companies, and philanthropies internationally. He currently serves as Executive Advisor to the Global Wellbeing Initiative, an effort between Gallup Inc. and the Wellbeing for Planet Earth Foundation to foster a more globally inclusive understanding of wellbeing for research, practice, and policy. He previously served as Chair of the European Health Psychology Society’s early career researcher division, and an executive committee member of the Academy of Management's Health Care Management division. Dr. Lai obtained his Master of Public Health from the University of Tokyo, and PhD in Health Policy and Management from Johns Hopkins University.

2021 Symposia on
VLSI Technology and Circuits

Panel Sessions

Technology Panel

3D/Heterogeneous integration: Are we running towards a Thermal Crisis?

Circuits Panel

New Generation Chip Makers vs. the Incumbents

Joint Panel

The New Normal… How will it Change Work, Life and Education?